View BR25A256FVT-3MGE2_8528101.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure silicon monolithic integrated circuit this product is not designed protection against radioactive ray s 1/ 28 tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com serial eeprom series automotive eeprom 105 op eration spi bus eeprom br25a 256 -3m general description br 25 a 256 -3m is a 256kbit serial eeprom of spi bus interface. features ? high speed clock action up to 10mhz (max) ? wait function by holdb t er m in al ? part or whole of memory arrays settable as read only memory area by program ? 2.5v to 5.5v single power source operation most suitable for battery use ? up to 64byte in page write mode. ? for spi bus interface (cpol, cpha) = (0, 0), (1, 1) ? self-timed programming cyc le ? low current consumption ? at write action (5v) : 0.7ma (typ) ? at read action (5v) : 2 .4 ma (typ) ? at standby action (5v) : 0.1a (typ) ? address auto increment function at read action ? prevention of write mistake ? write prohibition at power on ? write prohibition by command code (wrdi) ? write prohibition by wpb p in ? write prohibition block setting by status registers (bp1, bp0) ? prevention of write mistake at low voltage ? more than 100 years data retention. ? more than 1 million write cycles. ? bit format 32k 8 ? initia l delivery data memory array: ffh status register: wpen, bp1, bp0 : 0 packages w( typ) x d(typ) x h(max) tssop- b8 3.00mm x 6.40mm x 1.20mm sop- j8 4.90mm x 6.00mm x 1.65mm figure 1. datashee t downloaded from: http:///
datasheet 2/ 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com absolute maximum ratings (ta= 25 c ) parameter symbol ratings unit remarks supply voltage v cc -0.3 to +6.5 v power dissipation pd 0.45 (sop8) w when using at ta= 25 c or higher 4.5mw to be reduced per 1 c . 0.45 (sop-j8) when using at ta= 25 c or higher 4.5mw to be reduced per 1 c . 0. 33 (tssop-b8) when using at ta= 25 c or higher 3.3mw to be reduced per 1 c . storage temperature tstg - 65 to +1 50 c operating temperature topr - 40 to + 10 5 c input voltage / output voltage \ - 0.3 to vcc+1.0 v the max value of input voltage/output voltage is not over 6.5v . when the pulse width is 50ns or less, the min value of input voltage/output voltage is not under -1.0v. junction temperature tjmax 150 c junction temperature at the storage condition electrostatic discharge voltage (human body model) v esd -4000 to +4000 v caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in ca se the ic is operated over the absolute maximum ratings. memory cell characteristics (vcc=2.5v to 5.5v) parameter limits unit condition min typ max write cycles (note1) 1,000,000 - - times ta 25 c 15 0,000 - - times ta 10 5c data retention (note1) 100 - - years ta 25 c 20 - - years ta 10 5c (note1) not 100% tested recommended operating ratings parameter symbol ratings unit min max power source voltage vcc 2.5 5.5 v input voltage v in 0 v cc bypass capacitor c 0.1 - f input / o utput capacity (ta=25 c , frequency=5mhz) parameter symbol min max unit conditions input capacity (note1) c in 8 pf v in =gnd output capacity (note1) c out 8 v out =gnd (note1) not 100% tested. dc characteristics (unless otherwise specified, ta=- 40 c to + 10 5c, vcc= 2.5 v to 5.5v) parameter symbol limits unit conditions min typ max input high voltage v ih 0.7xvcc vcc+1.0 v input low voltage v il -0.3 (note1) 0.3xvcc v output low voltage v ol 0 0.4 v i ol =3.0 ma output high voltage v oh vcc- 0. 2 vcc v i oh =-2.0 ma input leakage current i li - 1 1 a v in =0 to vcc output leakage current i lo - 1 1 a v out =0 to vcc, csb=vcc supply current (write) i cc1 3 ma vcc=5.5 v, f sck =10mhz, t e/w =5ms byte write, page write, write status register supply current (read) i cc2 4 ma vcc=5.5v, f sck =10mhz, so=open read, read status register standby current i sb 10 a vcc=5.5v, so=open csb=holdb=wpb=vcc, sck=si=vcc or gnd (note1) wh en the pulse width is 50ns or less, it is -1.0v. downloaded from: http:///
datasheet 3/ 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com ac characteristics (ta=- 40 c to + 10 5c, 2.5v vcc<4.0v c l = 30 pf , 4.0v vcc 5.5 v c l =50 pf ) parameter symbol 2.5 vcc 5.5v 4.0v vcc 5.5v unit . m in typ max m in typ max sck frequency f sck 0.01 - 5 0.01 - 10 - sck h igh time t sckwh 80 - - 40 - - ns sck low time t sckwl 80 - - 40 - - ns csb high time t cs 40 - - 40 - - ns csb setup time t css 30 - - 30 - - ns csb h old time t csh 30 - - 30 - - ns sck setup time t scks 20 - - 20 - - ns sck hold time t sckh 20 - - 20 - - ns si setup time t dis 10 - - 10 - - ns si hold time t dih 10 - - 10 - - ns data output delay time t pd - - 70 - - 40 ns output hold time t oh 0 - - 0 - - ns output disable time t oz - - 40 - - 40 ns holdb setting setup time t hfs 0 - - 0 - - ns holdb setting hold time t hfh 20 - - 10 - - ns holdb release setup time t hrs 0 - - 0 - - ns holdb release hold time t hrh 20 - - 10 - - ns time from holdb to output high-z t hoz - - 40 - - 40 ns time from holdb to output change t hpd - - 40 - - 40 ns sck rise time (note1) t rc - - 2 - - 2 s sck fall time (note1) t fc - - 2 - - 2 s output rise time (note1) t ro - - 40 - - 40 ns output fall time (note1) t fo - - 40 - - 40 ns write time t e/w - - 5 - - 5 ms (note1) not 100% tested ac tim in g characteristics conditions parameter symbol limits unit conditions min typ max load capacitance c l - - 30 pf 2.5v vcc<4.0v - - 50 pf 4.0v vcc 5.5v input voltage - 0.2vcc/0.8vcc v input / output judgment voltage - 0.3vcc/0.7vcc v serial input / o utpu t timing figure 2-(a) . input timing figure 2-(b) . input / output timing cs b sck si so tcs tcss tscks tsckwl tsckwh tdis tdih trc tfc high-z figure 2-(c) . hold timing si is taken into ic inside in sync with data rise edge o f sck. input address and data from the most significant bit msb so is output in sync with data fall edge of sck. data is output from the most significant bit msb. cs b sck si so tpd toh tro,tfo toz tcsh tsckh tcs high-z cs b sck si n+1 "h" "l" n dn n-1 dn dn -1 holdb so dn+1 thfs thfh thoz thrs thrh tdis thpd high-z downloaded from: http:///
datasheet 4/ 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com block diagram pin configuration pin descriptions term in al name input /output function vcc - power source to be connected gnd - all input / output reference voltage, 0v cs b input chip select input sck input serial clock input si input ope code, address, and serial data input so output serial data output holdb input hold input command communications may be suspended temporarily (hold status) wp b input write protect input write status register command is prohibited figure 3. block diagram figure 4. pin configuration instruction decode control clock generation voltage detection write inhibition high voltage generator instruction register 256k eeprom address register data register address decoder read/write amp 8bit status register 1 csb 2 so 3 wpb 4 gnd 8 vcc 7 holdb 6 sck 5 si 15bit 8bit 15bit (top view) vcc holdb sck si csb so wpb gnd downloaded from: http:///
datasheet 5/ 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 7 output low voltage vs output current (vcc=2. 5v ) figure 8. output high voltage vs output current (vcc=2.5 v) figure 5. input high voltage vs supply voltage (csb,sck,si,holdb,wpb) figure 6. input low voltage vs supply voltage (csb,sck,si,holdb,wpb) typical performance curves (the following characteristic data are typ . values.) 2.2 2.3 2.4 2.5 2.6 0 0.5 1 1.5 2 2.5 i oh [ma] v oh [v] spec ta=-40c ta= 25c ta= 105c 0 1 2 3 4 5 6 0 1 2 3 4 5 6 vcc [v] v ih [v] ta=-40c ta= 25c ta= 105c spec 0 1 2 3 4 5 6 0 1 2 3 4 5 6 vcc [v] v il [v] spec ta=-40c ta= 25c ta= 105c 0 0.2 0.4 0.6 0.8 1 0 1 2 3 4 5 6 i ol [ma] v ol [v] spec ta=-40c ta= 25c ta= 105c downloaded from: http:///
datasheet 6/ 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 10 . output leakage current vs supply voltage (so) figure 12 supply current (read)vs supply voltage (f sck =10mhz) figure 9. input leakage current vs supply voltage (csb, sck, si, holdb, wpb) figure 11. supply current (write) vs supply voltage (f sck =10mhz) typical performance curv es \ continued 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 vcc [v] i li [ua] spec ta=-40c ta= 25c ta= 105c 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 vcc [v] i lo [ua] spec ta=-40c ta= 25c ta= 105c 0 1 2 3 4 0 1 2 3 4 5 6 vcc [v] i cc1 (ma) spec ta=-40c ta= 25c ta= 105c 0 2 4 6 8 10 0 1 2 3 4 5 6 vcc [v] i cc2 [ma] spec ta=-40c ta= 25c ta= 105c downloaded from: http:///
datasheet 7/ 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 13. standby current vs supply voltage figure 15. sck high time vs supply voltage figure 16. sck low time vs supply voltage figure 14. sck frequency vs supply voltage typical performance curves \ continued 0 2 4 6 8 10 12 0 1 2 3 4 5 6 vcc [v] i sb [ua] spec ta=-40c ta= 25c ta= 105c 0.1 1 10 100 0 1 2 3 4 5 6 vcc [v] f sck [mhz] spec ta=-40c ta= 25c ta= 105c spec 0 10 20 30 40 50 60 70 80 90 100 0 1 2 3 4 5 6 vcc [v] t sckwh [ns] ta=-40c ta= 25c ta= 105c spec spec 0 10 20 30 40 50 60 70 80 90 100 0 1 2 3 4 5 6 vcc [v] t sckwl [ns] ta=-40c ta= 25c ta= 105c spec spec downloaded from: http:///
datasheet 8/ 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 17. csb high time vs supply voltage figure 18. csb setup time vs supply voltage figure 19. csb hold time vs supply voltage figure 20. si setup time vs supply voltage typical performance curves \ continued 0 10 20 30 40 50 60 0 1 2 3 4 5 6 vcc [v] t cs [ns] ta=-40c ta= 25c ta= 105c spec 0 10 20 30 40 50 0 1 2 3 4 5 6 vcc [v] t css [ns] ta=-40c ta= 25c ta= 105c spec 0 10 20 30 40 50 0 1 2 3 4 5 6 vcc [v] t csh [ns] ta=-40c ta= 25c ta= 105c spec -5 0 5 10 15 20 25 30 0 1 2 3 4 5 6 vcc [v] t dis [ns] spec ta=-40c ta= 25c ta= 105c downloaded from: http:///
datasheet 9/ 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 21. si hold time vs supply voltage figure 22. data output delay time vs supply voltage figure 23. outpu t d is able time vs supply voltage figure 24. holdb setting hold time vs supply voltage t yp ical performance curves \ continued 0 10 20 30 40 0 1 2 3 4 5 6 vcc [v] t hfh [ns] spec ta=-40c ta= 25c ta= 105c spec -5 0 5 10 15 20 25 30 0 1 2 3 4 5 6 vcc [v] t dih [ns] ta=-40c ta= 25c ta= 105c spec 0 10 20 30 40 50 60 70 80 90 100 0 1 2 3 4 5 6 vcc [v] t pd [ns] spec ta=-40c ta= 25c ta= 105c spec 0 10 20 30 40 50 60 0 1 2 3 4 5 6 vcc [v] t oz [ns] spec ta=-40c ta= 25c ta= 105c downloaded from: http:///
datasheet 10 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 2 5. holdb release hold time vs supply voltage figure 26. time from holdb to output high- z vs supply voltage figure 27. time from holdb to output change vs supply voltage figure 28. output rise time vs supply voltage typical performance curves \ continued 0 10 20 30 40 0 1 2 3 4 5 6 vcc [v] thrh [ns] spec ta=-40c ta= 25c ta= 105c spec 0 10 20 30 40 50 60 0 1 2 3 4 5 6 vcc [v] thoz [ns] spec ta=-40c ta= 25c ta= 105c 0 10 20 30 40 50 60 0 1 2 3 4 5 6 vcc [v] t hpd [ns] spec ta=-40c ta= 25c ta= 105c 0 10 20 30 40 50 60 0 1 2 3 4 5 6 vcc [v] t ro [ns] spec ta=-40c ta= 25c ta= 105c downloaded from: http:///
datasheet 11 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com figure 29. output fall time vs supply voltage figure 30. write cycle time vs supply voltage typical performance curves \ continued 0 10 20 30 40 50 60 0 1 2 3 4 5 6 vcc [v] t fo [ns] ta=-40c ta= 25c ta= 105c spec 0 1 2 3 4 5 6 0 1 2 3 4 5 6 vcc [v] t e/w [ms] ta=-40c ta= 25c ta= 105c spec downloaded from: http:///
datasheet 12 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com features 1. status registers this ic has status register. the status register expresses the follo wing parameters of 8 bits. bp0 and bp1 can be set by write status register command. these 2 bits are memorized into the eeprom, therefore are valid even when power source is turned off. rewrite characteristics and data hold time are same as characterist ics of the eeprom. wen can be set by write enable command and write disable command. wen becomes write disable status when power source is turned off. r/b is for write confirmation, therefore canno t be set externally. the value of status register can be read by read status registe r command. (1) contexture of status register bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 wpen 0 0 0 bp1 bp0 wen r D /b b it memory location function wpen eeprom wp b pin enable / disable designation bit wpen=0=invalid wpen=1=valid bp1 bp0 eeprom eeprom write disable block designation bit wen registers write and write status register write enable / disable status confirm ation bit wen=0=prohibited wen=1=permitted r D /b registers write cycle status (ready / busy) status confirmation bit r D /b=0=ready r D /b=1=busy (2) write disable block setting bp1 bp0 write disable block 0 0 none 0 1 600 0h -7fffh 1 0 400 0h -7fffh 1 1 00 0 0h -7fffh 2. wp b p in by setting wp b=low, write command is prohibited. and the write command to be d isabled at this moment is wrsr. however, when write cycle is in execution, no interruption can be made. wrsr write prohibition possible but wpen bit 1 prohibition impossible 3. holdb p in by holdb pin, data transfer can be interrupted. when sck= 0 , by making holdb from 1 into 0 , data transfer to eeprom is interrupted. when sck = 0 , by making holdb from 0 into 1 , data transfer is restarted. downloaded from: http:///
datasheet 13 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com command m ode command contents ope code wren write enable command 0000 0110 wrdi write disable command 0000 0100 read read command 0000 0011 write write command 0000 0010 rdsr read status register command 0000 0101 wrsr write status register command 0000 0001 ti m in g chart 1. write enable (wren) / disable (wrdi) command this ic has write enable status and write disable status. it i s set to write enable status by write enable command, and i t is set to write disable status by write disable command. as for these commands, set csb low, and then input the respective op e codes. the respective commands are accepted at the 7-th c lock rise. even with input over 7 clocks, command becomes valid. when to carry out write command, it is necessary to set write e nable status by the write enable command. if write command is input in the write disable status, the command is cancelled. and even in the write enable status, once write command is executed, it gets in the write disable status. after pow er on, this ic is in write disable status. 2. read command (read) by read command, data of eeprom can be read. as for this command, set csb low , then input address after read ope code. eeprom starts data output of the designated address. da ta output is started from sck fall of 23-th clock, and from d7 to d0 sequentially. this ic has increment read function . after output of data for 1 byte (8bits), by continuing input of sck, data of the next address can be read. increment read can read all the addresses of eeprom. after reading data of the most significant address, by continuing increment rea d, data of the most insignificant address is read. wren (write enable ): write enable figure 31. write enable command high-z 6 0 3 7 1 2 4 5 csb sck so si 0 0 0 0 0 1 1 0 figure 32. write disable command wrdi (write disable): write disable high-z 0 0 0 0 si 0 1 0 0 0 3 1 2 4 7 csb sck 5 6 so high-z 11 1 1 0 0 3 7 1 2 d6 so cs b sck si 4 5 a 12 0 6 8 * a0 a1 d7 23 30 24 d0 0 0 0 0 0 d2 d1 9 10 a 13 a 14 30 31 figure 33. read command downloaded from: http:///
datasheet 14 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 3. write command (write) by write command, data of eeprom can be written. as for this comma nd, set csb low, then input address and data after write ope code. then, by making csb high, the eeprom starts writi ng. the write time of eeprom requires time of t e/w (max 5ms). during t e/w , other than read status register command is not accepted. se t csb high between taking the last data (d0) and rising the next sck clock. at the other tim in g, write command is not executed, and this write command is cancelled. this ic has page write function, and after input of data for 1 byte (8 bits), by continuing dat a input without setting csb high, 2byte or more data can be written for one t e/w . up to 64 arbitrary bytes can be written. in page write, the insignificant 6 bit of the designated address is incremented internally at every time when data of 1 byte is input and data is written to respective addresses. when data of the maximum bytes or higher is input, address rolls ov er, and previously input data is overwritten. 4. write status register, read status register command (wrsr/rdsr) write status register command can write data of status regi ster. the data can be written by this command are 3 bits , that is, wpen (bit7), bp1 (bit3) and bp0 (bit2) among 8 bits of status register. by bp1 and bp0, write disable block of eeprom can be set. as for this command, set csb low, and input ope code of write status register, and input data. then, by making csb high, eeprom starts writing. write time requires time of t e/w as same as write. as for csb rise, set csb high between taking the last data bit (bit0) and the n ext sck clock rising. at the other tim in g, command is cancelled. write disable block is determ in ed by bp1 bp0, and the block can be selected from 1/ 4, 1/2, and entire of memory array (refer to the write disable block setting table.). to the write disabled block, write cannot be made, and only read can be made. high-z =don't care 31 d0 0 0 0 0 0 d2 d1 d7 23 30 24 d6 0 a0 a1 * 1 1 2 4 0 cs b sck si so 0 3 7 8 5 6 a1 2 11 9 10 a1 3 a1 4 figure 34. write command cs b sck hi gh -z *=don't care 0 0 0 0 1 wpen 0 1 2 4 0 si so 0 3 7 8 5 6 * 9 10 11 12 13 14 15 * * bp1 bp0 * * bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 0 figure 35. write status register figure 36. read status register command high-z bit7 bit6 bit5 bit4 0 0 0 bit3 bit2 bit1 bit0 13 cs b sck si 1 1 10 6 0 so 14 1 2 wen r/b 11 15 3 7 9 0 5 12 0 0 0 0 0 4 8 wpen bp1 bp0 downloaded from: http:///
datasheet 15 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com wp b cancel valid area wp b is normally fixed to h or l for use, but when wp b is controlled so as to cancel write status register comm and, pay attention to the following wp b valid tim in g. while write status register command is executed, by setting wp b = l in cancel valid area, command can be cancelled. the area from command ope code to csb rise at internal automati c write start becomes the cancel valid area. however, once write is started, by any input write cycle cannot be cancelled. wp b input becomes don t care, and cancellation becomes invalid. hold b p in by holdb pin, command communication can be stopped tempora rily (hold status). the command communications are carried out when the holdb pin is high. to get in hold status, at c ommand communication, when sck=low, set the holdb pin low. at hold status, sck and si become don t care, and so becomes high impedance (high-z). to release the hold status, set the holdb pin high when sck=low. after that, com munication can be restarted from the point before the hold status. for example, when hold status is made a fter a5 address input at read, after release of hold status, by starting a4 address input, read can be restarted . when in hold status, keep csb low. when it is set csb=high in hold status, the ic is reset, therefore communication after that ca nnot be restarted. figure 37. wp b valid timing (at inputting wrsr command) 6 7 ope code data te/w data write time sck 15 16 invalid valid invalid downloaded from: http:///
datasheet 16 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com method to cancel each command 1. read, rdsr ? method to cancel : cancel by csb = h . 2. write , page write a ope code or address input area cancellation is available by cs b =h . b data input area (d7 to d1 input area) cancellation is available by cs b =h . c data input area (d0 area) in this area, cancellation is not available. when csb is set high, write starts. d t e/w area in the area c, by rising csb, write starts. while writing, by any input, cancellation cannot be mad e. note1) if vcc is made off during write execution, designated address data is not guaranteed, therefore write it once again. note2) if csb is rised at the same tim in g as that of the sck rise, write execution / cancel becomes unstable, there fore, it is recommended to rise in sck = l area. as for sck rise, assure tim in g of t css / t csh or more. 3. wrsr a from ope code to 15-th clock rise cancellation is available by csb= h . b from 15-th clock rise to 16-th clock rise (write enable area) in this area, cancellation is not available by csb= h . when csb is set high, write start s. c after 16-th clock rise. cancellation is available by cs b =h . however, if write starts (csb is rised) in the area b, cancellation cannot be made by any means. and, by inputting on sck clock, cancellation cannot be made. note1) if vcc is made off during write execution, designated address data is n ot guaranteed, therefore write it once again note2) if csb is rised at the same tim in g as that of the sck rise, write execution / cancel becomes unstable, there fore, it is recommended to rise in sck = l area. as for sck rise, assure tim in g of t css / t csh or more. 4. wren/wrdi a from ope code to 7-th clock rise, cancellation is available by csb = h . b cancellation is not available 7-th clock. figure 38. read cancel valid timing figure 39. rdsr cancel valid timing figure 42. wren/wrdi cancel valid timing ope code address a data t e/w b d c 8bits 8bits 16 bits d7 b d6 d5 d4 d3 d2 d1 d0 sck si c figure 41. wrsr cancel valid timing ope code address cancel available in all areas of read mode data 8 bits 8 bits 16 bits ope code cancel available in all areas of rdsr mode data 8 bits 8 bits ope code data t e/w 8 bits 14 15 16 17 d1 d0 a b c 8 bits a b c sck si ope code 8 bits 6 7 8 a b sck figure 40. wr ite cancel valid timing downloaded from: http:///
datasheet 17 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com i/o peripheral circuits in order to realize stable high speed operations, pay attention to the following input / output pin conditions. input pin pull up, pull down resistance when to attach pull up, pull down resistance to eeprom in put pin, select an appropriate value for the microcontroller v ol , i ol with considering v il characteristics of this ic. 1. pull u p resistance and, in order to prevent malfunction or erroneous write at power on/off, be su re to make csb pull up. 2. pull down resistance further, by amplitude v ihe , v ile of signal input to eeprom, operation speed changes. by inpu tting vcc/gnd level amplitude of signal, more stable high speed operations can be realized. on the contrary, when amplitude of 0.8v cc / 0.2vcc is input, operation speed becomes slow. *1 in order to realize more stable high speed operation, it i s recommended to make the values of r pu , r pd as large as possible, and make the amplitude of signal input to eeprom close t o the amplitude of v cc / gnd level. ( * 1 in this case, guaranteed value of operating tim in g is guaranteed.) 3. so load capacity condition load capacity of so output pin affects upon delay character istic of so output (data output delay time, time from holdb to high-z, output rise time, output fall time.). in order to make o utput delay characteristic into better, make so load capacity small. 4. other cautions make the each wire length from the microcontroller to eeprom in put pin same length, in order to prevent setup / hold violation to eeprom, owing to difference of wire length of each input. eeprom so c l figure 45. so load capacity figure 43. pull up resistance figure 44. pull down resistance ??? ??? example) when v cc =5v , v o hm =v cc -0.5v, i ohm 0.4ma , v ih e =v cc 0.7v, from the equation , ??? ??? with the value of rpu to satisfy the above equation, v olm becomes 0.4v or lower, and with v ile (=1.5v), the equation is also satisfied. ? v il e :eep ro m v il specifications ? v olm :microcontroller v ol specifications ? i olm :microcontroller i ol specifications example) when vcc=5v, v ile =1 .5v, v olm =0.4v, i olm =2ma, from the equation , i olm v ile v olm l output l input microcontroller eeprom r pu i ohm v ihe v ohm microcontroller eeprom h output h input r pd ] [3.2 10 2 4.0 5 3 ? ? ? ? ? k r r pu pu \ \ ] [3. 11 10 4.0 5.0 5 3 ? ? ? ? k r r pd pd \ \ ile olm olm olm cc pu v v i v v r ? ? ? ihe ohm ohm ohm pd v v i v r ? ? downloaded from: http:///
datasheet 18 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com i/o equivalence circuit 1. output circuit 2. input circuit figure 50. holdb input equivalent circuit figure 51. wp b input equivalent circuit figure 46. so output equivalent circuit figure 47. cs b input equivalent circuit figure 48. sck input equivalent circuit figure 49. si input equivalent circuit so internal signal internal signal csb internal signal internal signal sck internal signal holdb internal signal si internal signal wpb internal signal downloaded from: http:///
datasheet 19 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com power-up/down conditions 1. at standby set csb h , and be sure to set sck, si input l or h . do not input intermediate electric potantial. 2. at power on/off when vcc rise or fall, set csb= h (=vcc). when csb is l , this ic gets in input accept status (active). if power is tu rned on in this status, noises and the likes may cause malfunction, erroneous write or so. to prevent these, at power on, set csb h . (when csb is in h status, all inputs are canceled.) (good example) csb term in al is pulled up to vcc. at power off, take 10ms or more before supply. if power is tu rned on without observing this condition, the ic internal circuit may not be reset. (bad example) cs b term in al is l at power on/off. in this case, csb always becomes l (active status), and eeprom may have malfunction or erroneous write owing to noises and the likes. even when csb input is high-z, the status becomes like this case. 3. operating tim in g after power on as shown in figure 53, at standby, when sck is h , even if csb is fallen, si status is not read at fall edge. si status is read at sck rise edge after fall of csb . at standby and at power on/off, set csb h status. 4. at power on malfunction preventing function this ic has a por (power on reset) circuit as mistake write counte rmeasure. after por action, it gets in write disable status. the por circuit is valid only when power is on, and does not work when power is off. when power is on, if the recommended conditions of the following t r , t off , and v bot are not satisfied, it may become write enable status owi ng to noises and the likes. recommended conditions of t r , t off , v bot t r t off v bot 10ms or below 10ms or higher 0.3v or below 100ms or below 10ms or higher 0.2v or below 5. low voltage malfunction preventing function lvcc (vcc-lockout) circuit prevents data rewrite action at low powe r, and prevents wrong write. at lvcc voltage (typ . = 1.2v) or below, it prevent data rewrite. t r t off vbot 0 vcc figure 52. csb timing at power on/off cs b vcc bad example good example figure 54. rise waveform figure 53. operating timing 0 1 2 command start here. si is read. even if csb is fallen at sck= h , si status is not read at that edge. csb sck si downloaded from: http:///
datasheet 20 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com noise countermeasures 1. vcc noise (bypass capacitor) when noise or surge gets in the power source line, mal function may occur, therefore, for removing these, it is recommended to attach a bypass capacitor (0.1f) between ic vcc and gnd. at that time, attach it as close to ic as possible. and, it is also recommended to attach a bypass capacitor between board vcc and gnd. 2. sck noise when the rise time of sck (t rc ) is long, and a certain degree or more of noise exists , malfunction may occur owing to clock bit displacement. to avoid this, a schmitt trigger circu it is built in sck input. the hysteresis width of this circuit is set about 0.2v, if noises exist at sck input, set the noise amplitud e 0.2vp-p or below. and it is recommended to set the rise time of sck (t rc ) 100ns or below. in the case when the rise time is 100ns or higher, take sufficient noise countermeasures. make the clock rise, fall time as small as possi ble. 3. wp b noise during execution of write status register command, if there ex ist noises on wp b pin, mistake in recognition may occur and forcible cancellation may result. to avoid this, a sc hmitt trigger circuit is built in wp b input. in the same manner, a schmitt trigger circuit is built in csb input, si input and holdb input too . downloaded from: http:///
datasheet 21 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting t he analog block. furthermore, connect a capacitor to ground at all power s upply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic cap acitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground tra ces, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-sign al ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be ex ceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is w hen the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and dela ys, especially if the ic has more than one power supply. therefore, give special consideration to power coupli ng capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each o ther especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal parti cles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during as sembly to name a few. downloaded from: http:///
datasheet 22 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com operational notes C continued 11. unused input pins input pin s of an ic are often connected to the gate of a mos transistor . the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutua l interference among circuits, operational faults, or physica l damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoide d. furthermore, do not apply a voltage to the input pins wh en no power supply voltage is applied to the ic. even if the power suppl y voltage is applied, make sure that the input pin s have voltages within the values specified in the electrical chara cteristics of this ic. downloaded from: http:///
datasheet 23 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com ordering information b r 2 5 a 2 5 6 x x x - 3 m g e 2 lineup capacity package orderable part number type quantity 256 k sop8 reel of 25 00 br25a 256f -3mge2 sop- j8 br25a256fj -3mge2 tssop- b8 reel of 3000 br25a256fvt -3mge2 bus type 25 spi operating temperature/voltage - 40 c to +105c / 2.5v to 5.5v process code packaging and forming specification e2 : embossed tape and reel 256 =256k capacity product rank m : for automotive package f fj fvt : sop8 : sop- j8 : tssop-b8 g : halogen free downloaded from: http:///
datasheet 24 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information package name sop8 (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr) downloaded from: http:///
datasheet 25 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information - continued package name sop-j8 downloaded from: http:///
datasheet 26 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com physical dimension tape and reel information - continued package name tssop- b8 downloaded from: http:///
datasheet 27 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com marking diagrams sop8(top view) 5 a 25 part number marking lot number 1pin mark sop-j8(top view) 5 a 25 part number marking lot number 1pin mark tssop-b8(top view) 5 a 25 part number marking lot number 1pin mark downloaded from: http:///
datasheet 28 / 28 br25a 256 -3m tsz02201- 0r 1r0g100 39 0-1-2 22.dec.2014 rev.003 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com revision history date revision changes 18.feb.2014 001 new release 21.apr.2014 00 2 p.3 change load capacitance value to c l =50pf (4.0v vcc 5.5v) add min value of sck frequency delete input rise time and input fall time of ac ti m in g characteristics conditions 22.dec.2014 003 p.1 change a current consumption at the time of the read move ment of it to the write movement of the low current consumption. p.1 delete aec-q100 qualified. p. 2 add electrostatic discharge voltage at absolute maximum ratings . p. 2 add bypass capacitor at recommended operating ratings. p.3 ac characteristics minimum supply voltage change 2.5v -> 4.0v p.3 add table of 2.5v vcc 5.5v in ac characteristics.(sck frequency max 5mhz, sck high time 80ns, sck low time 80ns, data output delay time 70ns) p.4 fu nction correction of si and wpb of pin descriotions. p.5-11 update graph data p.23 delete remark at lineup. downloaded from: http:///
datasheet d a t a s h e e t notice-ss rev.004 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-ss rev.004 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BR25A256FVT-3MGE2

	To Download BR25A256FVT-3MGE2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .